Hanmi Semiconductor (042700.KS) will invest 130 billion won ($94 million) to build a new production base as demand grows for chip-packaging equipment used in artificial intelligence semiconductors.
The company said on the 18th that it will buy a 6,230-pyeong (about 20,600-square-meter) plant in the Juan National Industrial Complex in Incheon from Mercury Co. and develop it into its eighth plant. It will be the largest by floor area among the company's plants.
The total investment is 130 billion won, including 56 billion won for the plant purchase. Hanmi Semiconductor plans to remodel the existing facility and build advanced production infrastructure, with mass production set to begin in the second quarter of 2027.
The eighth plant will produce thermal compression (TC) bonders and hybrid bonders for high-bandwidth memory (HBM), 2.5-dimensional packaging equipment for AI chips, and BOC and COB equipment for high-performance memory.
The company expects its total production-line floor area to grow to 34,318 pyeong once both the eighth plant and the seventh plant — a hybrid-bonder-only facility scheduled for completion in the first half of 2027 — are in operation. Last year, it also invested 100 billion won in building the seventh plant.
A Hanmi Semiconductor official said the company's core competitiveness lies in its ability to supply equipment in line with customers' manufacturing-facility investment schedules. "Through the investments in the seventh and eighth plants, we will secure production capacity ahead of demand and respond stably to customer needs," the official said.
