LG Electronics (066570.KS) has unveiled its first "modular cooling" solution, which allows cooling equipment for artificial intelligence data centers to be assembled like building blocks. By prefabricating core components such as pumps and piping at a factory and connecting them to chillers on site, the company aims to shorten data center construction time and reduce upfront investment.
LG Electronics said it introduced its Hydronic Modular solution at Data Centre World Asia (DCWA) 2026, Asia's largest data center exhibition, which opened in Singapore on the 29th.
The Hydronic Modular is a finished product in which cooling equipment including pumps, valves, emergency buffer tanks and piping is pre-assembled inside a container built to International Organization for Standardization (ISO) specifications. Operators can set up a cooling system quickly at a data center site simply by connecting chillers to the container module with piping.
Because the cooling equipment is prefabricated, on-site welding and assembly work is reduced, shortening construction time for hyperscale AI data centers. Another advantage is that data center operators can phase in capital expenditure as demand grows, rather than investing in large-scale cooling equipment from the outset.
LG Electronics also displayed an air-cooled, oil-free inverter turbo chiller that produces the chilled water needed to cool data center servers. The product uses magnetic bearings that levitate the rotating shaft so that components inside the compressor do not touch each other, reducing energy loss from friction.
The company is also expanding its liquid cooling lineup in response to the spread of high-density AI servers. LG Electronics offers coolant distribution units (CDUs) ranging from 600 kilowatts to megawatt class. At the exhibition, it showed 1-megawatt and 2.6-megawatt CDUs that have received Nvidia's quality certification.
LG Electronics is also developing immersion cooling technology, in which servers are submerged directly in coolant. Over the longer term, the company plans to expand into a "Chip to Chiller" solution covering the entire data center thermal management process, from chillers that produce chilled water to CDUs and cold plates that absorb heat directly from chips.
"We will leap forward as a key partner in the global AI infrastructure market on the strength of total cooling solutions optimized for hyperscale AI data centers," said Lee Jae-sung, president and head of LG Electronics' ES Business Solution Company.
